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| www..com AgilentHSME-C110/C120/C150/ C170/C177/C190/C191/C197/C265 AlInGaP Green ChipLED Data Sheet Features * Small size * Industry standard footprint * Operating temperature range of -30C to +85C * Compatible with IR soldering * Available in 8 mm tape on 7" diameter reel * Reel sealed in zip-locked moisture barrier bags Description This chip-type LED utilizes Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output. These chipLEDs come in top mounting, top emitting packages (HSMx-C150/170/177/190/191/197), top mounting, side emitting packages (HSMx-C110/120) or reverse mounting, top emitting package (HSMx-C265). Applications * Membrane switch indicator * LCD backlighting * Pushbutton backlighting * Front panel indicator * Symbol backlighting * Keypad backlighting All packages are binned by both color and intensity. In order to facilitate pick and place operation, these chipLEDs are shipped in Tape & Reel, with 4000 units per reel for HSMxC120/170/ 177/190/191/197 and 3000 units per reel for HSMxC110/C150/265. These packages are compatible with reflow soldering process. Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product(s) at anytime. Package Dimensions LED DIE CATHODE LINE LED DIE 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 3.2 (0.126 ) CLEAR EPOXY 1.5 (0.059) 0.30 (0.012) PC BOARD 0.5 (0.020) CATHODE LINE 0.40 0.15 (0.016 0.006) 0.40 0.15 (0.016 0.006) PC BOARD 1.6 (0.063 ) 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 0.80 (0.031) 0.30 (0.012) POLARITY 2.00 (0.079 ) 0.62 (0.024) CATHODE MARK DIFFUSED EPOXY 1.40 (0.055) POLARITY 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 LED DIE CATHODE MARK LED DIE CATHODE MARK 0.8 (0.031) 0.4 (0.016) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 1.6 (0.063 ) 1.0 (0.039) 0.3 (0.012) POLARITY 1.0 (0.039) 0.3 (0.012) POLARITY DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. PC BOARD 0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 2 LED DIE CATHODE MARK 3.40 (0.134) LED DIE CATHODE MARK (ETCHED) 1.6 (0.063) 0.8 (0.031) 1.25 (0.049) 3.2 (0.126 ) DIFFUSED EPOXY 0.6 (0.024) 2.0 (0.079) POLARITY UNDIFFUSED EPOXY 1.1 (0.043) 2- 1.10 (0.043) PC BOARD 0.5 (0.020) 1.20 (0.047) POLARITY PC BOARD 1.10 (0.043) CATHODE LINE 0.5 0.2 (0.020 0.008) 0.5 0.2 (0.020 0.008) CATHODE LINE 0.30 (0.012) 2- 0.50 0.15 (0.020 0.006) SOLDERING TERMINAL HSMx-C150 HSMx-C265 CATHODE MARK LED DIE CATHODE MARK LED DIE 0.80 (0.031) 1.6 (0.063) 0.3 (0.012) 0.6 (0.024) 1.60 (0.063) 0.40 (0.016) POLARITY DIFFUSED EPOXY PC BOARD 0.40 (0.016) PC BOARD CLEAR EPOXY 1.2 (0.047) POLARITY 1.0 (0.039) 0.5 (0.020) 0.16 (0.006) 0.30 0.15 (0.012 0.006) CATHODE LINE CATHODE LINE 3 - 0.3 (0.012) 0.70 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C197 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. HSMx-C120 3 Package Dimensions, continued CATHODE MARK LED DIE 1.25 (0.049) 0.62 (0.025) 2.00 (0.079) POLARITY DIFFUSED EPOXY 0.40 (0.016) PC BOARD 0.16 (0.006) CATHODE LINE 0.40 0.15 (0.016 0.006) 1.10 (0.043) SOLDERING TERMINAL HSMx-C177 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 4 Device Selection Guide Package Dimension (mm)[1,2] 1.6 (L) x 0.8 (W) x 0.6 (H) 1.6 (L) x 0.8 (W) x 0.4 (H) 1.6 (L) x 0.8 (W) x 0.8 (H) 2.0 (L) x 1.25 (W) x 0.8 (H) 2.0 (L) x 1.25 (W) x 0.4 (H) 1.6 (L) x 0.6 (W) x 1.0 (H) 3.2 (L) x 1.0 (W) x 1.5 (H) 3.2 (L) x 1.6 (W) x 1.1 (H) 3.4 (L) x 1.25 (W) x 1.1 (H) AlInGaP Green HSME-C191 HSME-C197 HSME-C190 HSME-C170 HSME-C177 HSME-C120 HSME-C110 HSME-C150 HSME-C265 Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-diffused Untinted, Non-diffused Untinted, Diffused Untinted, Non-diffused Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current[1,2] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSME-C110/120/170/177/ 190/191/197/150/265 20 52 5 95 -30 to +85 -40 to +85 Units mA mW V C C C See reflow soldering profile (Figures 6 & 7) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive current above 5 mA is recommended for best long term performance. Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 2.1 2.1 2.1 2.6 2.6 2.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 18 15 16 Thermal Resistance RJ-PIN (C/W) Typ. 550 450 450 Part Number HSME-C110/120 HSME-C150/170/177/190/191/197 HSME-C265 5 Optical Characteristics at TA = 25C Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. 18 18 18 18 18 52 52 50 50 50 Peak Wavelength peak (nm) Typ. 570 570 570 570 570 Color, Dominant Wavelength d[2] (nm) Typ. 572 572 572 572 572 Viewing Angle 2 1/2 Degrees[3] Typ. 130 155 170 130 170 Luminous Efficacy V(lm/w) Typ. 570 570 570 570 570 Part Number HSME-C110 HSME-C120 HSME-150/170/ 190/191 HSME-C177/197 HSME-C265 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Green Color Bin Limits[1] Dom. Wavelength (nm) Bin ID A B C D E Min. 561.5 564.5 567.5 570.5 573.5 Max. 564.5 567.5 570.5 573.5 576.5 Light Intensity (IV) Bin Limits[1] Intensity (mcd) Bin ID A B C D E F G H J K L M N P Q R S T U Min. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 45.00 71.50 112.50 180.00 285.00 450.00 Max. 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 Tolerance: 0.5 nm Tolerance: 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. 6 100 IF - FORWARD CURRENT - mA 100 1.2 1.0 0.8 0.6 0.4 0.2 0 RELATIVE INTENSITY - % 90 80 70 60 50 40 30 20 10 0 400 450 500 550 600 650 700 10 1 0.1 1.5 1.6 LUMINOUS INTENSITY (NORMALIZED @ 20 mA) 1.7 1.8 1.9 2.0 2.1 2.2 0 5 10 15 20 25 30 WAVELENGTH - nm VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. IF MAX. - MAXIMUM FORWARD CURRENT - mA 25 RELATIVE INTENSITY - % 100 90 20 80 70 60 50 40 30 20 10 15 10 5 0 0 10 20 30 40 50 60 70 80 90 100 TA - AMBIENT TEMPERATURE - C 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum forward current vs. ambient temperature. Figure 5a. Relative intensity vs. angle for HSMx-C170, HSMx-C190, HSMx-C191, and HSMx-C150. 100 90 RELATIVE INTENSITY - % 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5b. Relative intensity vs. angle for HSMx-C177 and HSMx-C197. 7 100 RELATIVE INTENSITY - % 80 60 40 20 0 -100 -80 -60 -40 -20 0 ANGLE 20 40 60 80 100 100 RELATIVE INTENSITY - % 80 60 40 20 0 -100 -80 -60 -40 -20 0 ANGLE 20 40 60 80 100 Figure 5c. Relative intensity vs. angle for HSMx-C110. 100 90 RELATIVE INTENSITY - % 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5d. Relative intensity vs. angle for HSMx-C120. 8 100 90 RELATIVE INTENSITY - % 80 70 60 50 TEMPERATURE 10 SEC. MAX. 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC. 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5e. Relative intensity vs. angle for HSMx-C265. Figure 6. Recommended reflow soldering profile. 10 to 20 SEC. 217 C 255 C (+5/-0) 3 C/SEC. MAX. 100 - 150 C 6 C/SEC. MAX. TEMPERATURE 2.2 (0.087) DIA. PCB HOLE MAX. 120 SEC. 60 to 150 SEC. 1.25 (0.049) TIME * THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX. 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) Figure 7. Recommended Pb-free reflow soldering profile. Figure 8. Recommended soldering pattern for HSMx-C265. 5.0 (0.200) 0.4 (0.016) 0.4 (0.016) 0.9 (0.035) 0.9 (0.035) 0.7 (0.028) 0.15 (0.006) CENTERING BOARD 0.8 (0.031) 1.2 (0.047) 0.8 (0.031) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) 0.2 (0.008) 1.0 (0.039) CENTERING BOARD Figure 9. Recommended soldering pattern for HSMx-C120. Figure 10. Recommended soldering pattern for HSMx-C110. 0.8 (0.031) 1.2 (0.047) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 11. Recommended soldering pattern for HSMx-C170 and HSMx-C177. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 12. Recommended soldering pattern for HSMx-C190, HSMx-C191 and HSMx-C197. Figure 13. Recommended soldering pattern for HSMx-C150. 9 USER FEED DIRECTION xxx xxxxx xxxxx xxxxx xxxxx CATHODE SIDE xx PRINTED LABEL Figure 14. Reeling orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 13.1 0.5 (O 0.516 0.020) O 20.20 MIN. (O 0.795 MIN.) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Figure 15. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 10 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) 1.86 (0.073) 1.80 (0.071) 2.30 (0.091) 3.35 (0.132) 3.50 (0.138) 1.90 (0.075) 1.75 (0.069) 2.30 (0.091) 0.89 (0.035) 0.95 (0.037) 1.45 (0.057) 1.85 (0.073) 1.88 (0.074) 1.15 (0.045) 0.95 (0.037) 1.40 (0.055) 0.87 (0.034) 0.87 (0.034) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050) 0.80 (0.031) 0.60 (0.024) 0.60 (0.024) HSMx-C110/C120 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) HSMx-C191 SERIES HSMx-C190 SERIES HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES HSMx-C120 SERIES HSMx-C197 SERIES HSMx-C177 SERIES DIM. B (SEE TABLE 1) HSMx-C110 HSMx-C120 R 1.0 0.05 R 0.5 0.05 (0.039 0.002) (0.020 0.002) 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 1.30 (0.051) HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) Figure 16. Tape dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 11 END START Convective IR Reflow Soldering For more information on soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 5C for 20 hours. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 17. Tape leader and trailer dimensions. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004 Agilent Technologies, Inc. Obsoletes 5988-7659EN April 28, 2004 5989-0520EN |
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